Japanese Version

SiC,MEMS,Silicon carbide,GaP,GaAs,Si,Photomask,Sapphire,Synthetic quartz,Substrate,Polishing,Semiconductor,Compound,Back-grinding,Back polishing,Cleaning,Metal-film deposition,Semiconductor sales,Epi,Heavy metals corresponding

we are offering semiconductor polishing, the work of the state-of-the-art equipment. We respond to customer requirements with high polishing technique.

Welcome to Chichibu Denshi Group Home Page!!

We are technology oriented processing company specializing in

  • Silicon Wafer
  • Compound Wafer(Gap,GaAs,InP etc)
  • Silicon Carbide(Sic) Wafer
  • Gallium Nitride(GaN) Wafer
  • Sapphire Wafer
  • Various kinds of MEMS Wafer

In addition to the polishing, we are offering the following processing services.

  • Dicing
  • Chamfering
  • Metal Vapor Deposition
  • Epitaxial Layer Growing

Our technology is highly evaluated as shown below.

  • One of the Best Small Size Processing Companies in Japan by Ministry of Economy, Trade and Industry in 2006.
  • One of the Best 100"not yet known" Companies in Japan by The News Week in October 2007.

What's NEW

TXRF is installed at Midorigaoka Plant for metal contamination check.June2014
SiC Wafer BackSide Polishing Service
(Chamfering + BackSide Polishing + Metal Free Cleaning)
November2013
SiC Wafer Repolishing(Recycling) ServiceNovember2013
Chamfering Service
(applicable to various kinds of semicondactor material)
October2013
Total Service (Si and GaAs Wafer) of
BackSide Polishing + Metal Vapor Deposition + Dicing
August2013
Silicon Bar ProductionApril2013
Si Wafer Back Side Polishint Metal Free Cleaning ServiceMarch2013
Wafer Dicing Service (Si and GaAs Wafer)February2013
R&D Project of the Strategic and Basic Technology
was commissioned by Ministry of Economy, Trade and Industry
June2010

Product Line-up

Glass Polishing
Material:
Synthetic quartz, Low expansion, Non alkali, Soda lime, White crown, etc.
Size:
  • 4, 5, 6, 7, 8, 9 inch square
  • 4, 5, 6, 8 inch wafer
Specification:

  • Flatness 0.5um
  • Particle here : 0.1umlevel
  • Roughness(Pa) 1.5
Inspection tool:

  • MAGICS
  • AFM
  • NIDEK
Service offered:

  • new glass polishing
  • used glass polishing (recycling)
32B Both side polishing machine

Both Side Polishing Machine

Compound Wafer Polishing
Material:
GaP, GaAs, InP
Size:
  • 2, 3, 4, 6 inch wafer
  • Irregular size and shape wafer
Specification:

  • Finished Thickness 50um
  • Surface Level : EPI Ready Level
Inspection tool:

  • Blue Raser Candela
Service offered:

  • as sliced wafer polishing
  • epitaxial wafer polishing
  • used wafer polishing (recycling)
  • grooving and edge grinding
  • chamfering
Polishing Machine

Polishing Machine

Back Side Polishing (Grinding) and Dicing
Material:
Si and GaAs processed wafer
Size:
  • 4,5,6,8,12inch wafer
    (wafer with bump on the surface is possible)
Specification:

  • Finished thickness 50um
  • Thickness variation 2um
Service offered:

  • Back Side Grinding,Lapping and Polishing of
    • regularly patterned wafer
    • bump patterned wafer
    • Arsenide doped wafer
12inch wafer

12 inch wafer

MEMS Wafer Polishing
Material:
Si wafer with MEMS pattern on the surface
Size:
  • 4, 5, 6, 8, 12 inch wafer
Specification:

  • Metal Free cleaning
  • Particle none : 0.3um Level
Inspection tool:

  • Film Thickness Measuring Machine
Service offered:

  • MEMS surface polishing with film thickness control
Wide Gap Semicoductor Wafer Polishing
Material:
SiC, GaN, Sapphire, GaN on Si,GaN on Sapphire, AlN,etc
Size:
  • 2, 3, 4, 6 inch wafer
Specification:

  • Metal Free cleaning
  • Flatness
    • SBIR 1um
    • GBIR 2um
    • Roughness(Ra) 0.05um
Inspection tool:

  • Blue Raser Candela
  • NIDEK
  • AFM
  • Edge Profiler
Plant for wide Gap Semicoductor Wafer Polishing

Midorigaoka Plant
for Wide Gap Semicoductor
Wafer Polishing

Service offered:

  • as sliced wafer polishing
  • epitaxial wafer polishing
  • back side grinding, lapping and polishing of processed wafer
    (Chamfering + back side grinding, lapping and polishing + metal free cleaning)
  • used wafer polishing (recycling)
Metal Vapor Deposition
Material:
Si and GaAs
Size:
  • 2, 3, 4, 5, 6, 8 inch wafer
Specification:

  • Metal Available : Au, Pt, Ti, Ni, Al, Cu, etc
Inspection tool:

  • Film Thickness Measuring Machine
Service offered:

  • not only metal vapor deposition but also combination of polishing, metal vapor deposition and dicing
Metal Vapor Deposition Machine

Metal Vapor Deposition Machine

Epitaxial Layer Growing on Si wafer
Material:
Si
Size:
  • 4, 5, 6 inch wafer
Service offered:

  • epitaxial layer growing
    (epitaxial layer growing in a narrow trench is possible)
  • NBL deposition
Epitaxial Layer Growing
Si Monitor and Dummy Wafer
Material:
Si monitor and dummy wafer
Size:
  • 4, 5, 6, 8, 12 inch wafer
Specification:

  • Metal Free Cleaning
  • Particle none : 0.3um Level
Service offered:

  • virgin monitor and dummy wafer
  • recycling of monitor and dummy wafer (Repolishing)
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Technology Development

Highly Sophisticated Extreme Flatness Polishing Technology
  • Highly Sophisticated combination of polishing powder, pad and machine is indispensable for the extreme flatness.
  • How to stick wafer on the plate is one of the core technology for one-side polishing.
  • Our polished product line covers a wide application area from Si, GaP, GaAs, SiC, GaN and Sapphire wafer to Synthetic Quartz Glass.
Ultra Clean Cleaning Technology
  • Our particle free and metal free cleaning technology coupled with the extreme flatness polishing technology can meet very high-end specifications of our clients.
High Precision Special Wafer Processing Technology
  • Polishing-affiliated process such as edge-grinding, glass cutting, dicing, chamfering, metal vapor deposition, etc. are also offered with high precision.
  • Surface processing technology such as epitaxial growth, etching, etc. are also materialized in our process with highly sophisticated level.
  • Very special grinding, lapping and polishing technologies enable the thickness of 50 um.
  • These special wafer processing technologies are expanding the application area of our key technologies.
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Quality

ISO9001/TS16949
July
2003 : ISO9001 year 2000 Version certified.
March
2008 : TS16949 certified.
March
2010 : Moved to ISO9001 Year 2008 Version and
          TS16949 Year 2009 Version.
Certified Proof
Inspection Tools

We are full equipped with the most up to date inspection and analysis tools for the pursuit of extreme quality level as shown below.

Our systemized measurement and analysis technologies combined with the highly-sophisticated inspection tools are facilitating the feed back of the quality information to our production process. This is contributing to the improvement of the quality and reliability of our products.

CandelaMAGICSNIDIKAFM
Candela CS10 MAGICS 3320 NIDIK FT-900 TXRF
TXRF
TXRF
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Environment

In Harmony with Environment based on ISO14001.
  • Our plant is equiped with the perfect facilities for processing wasted water and exhausted gas to live together with the Chichibu's affluent nature.
  • Our plant is designated as a model plant of Saitama prefecture called "Sainokuni Shitei Kojo",taking the leadership in the regional industry.
Certified Proof
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Corporate Introduction

Greetings form Presidemt

Chichibu Denshi Corp. was founded in 1967 as an assembly maker of diode and transistor. Since then, we have made strenuous efforts to be a top semi-conductor material processing company. We recognize the satisfaction of our clients as our raison d'etre and earnestly hope that we can contribute not only to our clients but also to the society in the era of Internet. We are always looking forward to your giving us an opportunity to support your business as a top manufacturer in the field of electrical material processing. Thank you.

President
Takahiko Suneya
President
Management Philosophy

We have been positively deploying our semiconductor material processing business in both domestic and international market. Our core management concept is "To contribute to the society, thriving together with our clients, staff and region." This core concept is materialized through our three prime corporate strategies.

  • Stably growing through related diversification
  • Marketing and Research & Development firmly rooted
    on our clients' needs
  • Restless pursuit of the best of quality, cost and delivery
Introduction of Chichibu Denshi Group

Chichibu Denshi Corporation

Address
368-0004
2178 Yamada Chichibu-shi Saitama-ken, Japan
Tel No.
+81 494 22 5955
Fax No.
+81 494 22 5959
Capital
80 million yen
Employee
75
Chichibu Denshi Corporation

Chichibu Electron Corporation

Address
368-0101
1111 Shimo ogano Pgano-machi
Chichibu-shi Saitama-ken, Japan
Tel No.
+81 494 75 3333
Fax No.
+81 494 75 3392
Capital
46 million yen
Employee
85
Chichibu Electron Corporation

Chichibu Electron Corporation
(Midorigaoka plant)

Address
368-0067
70 Midorigaoka Chichibu-shi Saitama-ken, Japan
Tel No.
+81 494 63 1733
FAX No.
+81 494 62 5277
Midorigaoka Plant
Chichibu Denshi Group History

45 years since the foundation is the proof of the high performance and the credibility.

YearHistoryR&D,Production and Sales
1967
  • Chichibu Denshi Corp. founded
  • Si diode device production
1968
  • Increase in capital to 20 million Yen
1970
  • Increase in capital to 40 million Yen
1977
  • Photomask substrate polishing
1980
  • Takinoue Plant built
1983
  • Hinoda Plant built
1985
  • Chichibu Electron Corp. founded
  • Si wafer defusion and polishing
1986
  • Chichibu Erectron Ogano Plant buiut in Ogano-machi
  • GaP wafer polishing
1987
  • Increase in capital to 80 million Yen
1988
  • LCD glass polishing
1991
  • Photomask patterning and inspection
  • GaAs wafer polishing
1994
  • Si wafer slicing and edge-grinding
1995
  • Chichibu Electron Second Plant built
1996
  • Epitaxial layer growth on Si
1997
  • Silicon Monitor / Dummy Wafer (recycle and virgin)
1998
  • ISO9002 certified
  • Sapphire wafer polishing
1999
  • Technology coordination business started covering China, Taiwan and Korea
2000
  • Increase in production capacity of GaAs Wafer Polishing
  • Extremely thin Si and GaAs wafer polishing
2001
  • Increase in production capacity of super grade photomask substrate
  • InP wafer polishing
  • DWDM filter glass polishing
2003
  • ISO9001 certified
  • Increase in the capacity of epitaxial layer growing
2004
  • ISO14001 certified
  • 12inch wafer processing
2006
  • Increase in the capital of Chichibu Electron Corp. to 46 million yen
  • GaAs Metal Vapor Deposition
2007
  • Sic, GaN, Sapphire wafer polishing
2008
  • TS16949 certified
  • Midorigaoka Plant acquired
  • MEMS wafer polishing
2009
  • Invest in Vegetable Plant Corp
  • Introduced in Nikkei Business as one of the hidden world company
  • SiC polishing technology development project is subsidized by Ministry of Economy, Trade and Industry(METI)
2010
  • Midorigaoka Plant started the operation
  • Sapphire grinding technology development project is subsidized by METI
2012
  • GaN polishing technology development project is subsidized by METI
2013
  • Si and GaAs wafer dicing
  • Si bar business
  • Wafer chamfering
Access

Chichibu Denshi Corp

By Train
  • 10minutes from Seibu Chichibu station by taxi
  • 15minutes from Chichibu station by taxi
By Car
  • Route 140: To Yamada at Onohara crossing
  • Route 299: To Yamada at Sakagohri crossing

Chichibu Electron Corp

By Train
  • 20minutes from Seibu Chichibu station by taxi
  • 20minutes from Chichibu station by taxi
By Car
  • Route 299: To Ogano city

Chichibu Electron Corp(Midorigaoka Plant)

By Train
  • 15minutes from Minano station by taxi
  • 20minutes from Chichibu station by taxi
By Car
  • Route 299:To Midorigaoka
Map
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Employment

Employment Information

yWe are not recruiting presentlyz

Capability Development System

Many capability development courses are ready for any motivated employees two Year.
Holiday
116 days (Complete 5 day wark week system)
Bonus
Twice a year
Welfare
Various kinds of activities planned by employees
Short trip,Hot Summer Party, Christmas Party, etc
senior employee
University Graduates
Starting Salary : more than 189,000yen.
Two Year College Graduates
Starting Salary : more than 163,000yen.
High School Graduates
Starting Salary : more than 157,000yen.
Massage from Senior Employee
Ryohei Arai

Ryohei Arai

School
Takushoku University
Date Employed
March 3, 2008
Age
28 year old
Belonging
Facility Management Group

Six years since I joined Chichibu Denshi. I am belonging to Facility Management Group. Every day, full of new experiences and excited. Chichibu Area has many festivals and full of the beautiful nature. I am devoting my self to my task at Chichibu Denshi and outdoor activities in the good nature in Chichibu.


Junya Arai

Junya Arai

School
Nihon Institute of Technology
Department of Electric Engineering
Date Employed
April 1, 2002
Age
30 year old
Belonging
Engineering Group

I am engaging technology development of quartz glass polishing and cleaning to meet our client's future needs. I am positively challenging my role by applying what I learned at my university. I am very happy to be a member of the technology development project.

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